GENEVA, Oct. 9 -- RESONAC CORPORATION filed a patent application (JP2026/013086) for “RESIN-COATED SUBSTRATE, METHOD FOR PRODUCING RESIN-COATED SUBSTRATE, PRINTED WIRING BOARD, AND ELECTRONIC COMPONENT DEVICE”. With publication no. WO/2026/211717, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H05K 1/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....