International Patent: RESIDUAL VIBRATION REDUCTION IN MAGNETICALLY-COUPLED WAFER-HANDLING ROBOT VIA INPUT SHAPING

GENEVA, Oct. 9 -- THE REGENTS OF THE UNIVERSITY OF MICHIGAN filed a patent application (US2026/021818) for “RESIDUAL VIBRATION REDUCTION IN MAGNETICALLY-COUPLED WAFER-HANDLING ROBOT VIA INPUT SHAPING”. With publication no. WO/2026/213246, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: B25J 9/16

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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