GENEVA, June 19 -- HUAWEI TECHNOLOGIES CO., LTD. filed a patent application (CN2025/072056) for “RELAY CONNECTION ESTABLISHMENT METHOD AND APPARATUS”. With publication no. WO/2025/171758, here are the other details related to the patent application:
Kind: Corrected version of pamphlet [A9]
IPC: H04W 40/22
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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