INTERNATIONAL PATENT: RAYTHEON COMPANY FILES APPLICATION FOR "ADDITIVELY MANUFACTURED ELECTRONICS PACKAGING WITH INTEGRATED LEAK DETECTION CIRCUIT"

GENEVA, April 20 -- RAYTHEON COMPANY (1100 Wilson BlvdArlington, Virginia 22209) filed a patent application (PCT/US2025/050550) for "ADDITIVELY MANUFACTURED ELECTRONICS PACKAGING WITH INTEGRATED LEAK DETECTION CIRCUIT" on Oct 10, 2025. With publication no. WO/2026/080877, the details related to the patent application was published on Apr 16, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MA, Fernando (9491 N. WEATHER HILL DR.TUCSON, Arizona 85743), NORTHRUP, Mark R. (6557 W. Grandview TrailMarana, Arizona 85685)

Abstract: An additively manufactured electronics packaging assembly including ...