GENEVA, July 14 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/010213) for "USING AN ISO BMFF FILE TO STORE 3D OBJECT MODEL DATA" on Jan 03, 2025. With publication no. WO/2025/147593, the details related to the patent application was published on Jul 10, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BOUAZIZI, Imed (5775 Morehouse DriveSan Diego, California 92121-1714), SARKIS, Michel Adib (5775 Morehouse DriveSan Diego, California 92121-1714), LEUNG, Nikolai Konrad (5775 Morehouse D...