INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "THREE-DIMENSIONAL RECONSTRUCTION (3DR) MESH COMPRESSION FOR EXTENDED REALITY (XR) SYSTEMS"

GENEVA, May 12 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/045817) for "THREE-DIMENSIONAL RECONSTRUCTION (3DR) MESH COMPRESSION FOR EXTENDED REALITY (XR) SYSTEMS" on Sep 10, 2025. With publication no. WO/2026/096091, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KRISHNAN, Nikhil (5775 Morehouse DriveSan Diego, California 92121), ANAND, Ankit (5775 Morehouse DriveSan Diego, California 92121), MELKOTE KRISHNAPRA...