INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "TECHNIQUES FOR COMMUNICATING A TRANSPORT BLOCK OVER MULTIPLE LAYERS IN WIRELESS COMMUNICATIONS"

GENEVA, March 18 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/038213) for "TECHNIQUES FOR COMMUNICATING A TRANSPORT BLOCK OVER MULTIPLE LAYERS IN WIRELESS COMMUNICATIONS" on Jul 18, 2025. With publication no. WO/2026/054888, the details related to the patent application was published on Mar 12, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KHOSHNEVISAN, Mostafa (Qualcomm IncorporatedATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714), HOSSEIN...