INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "SUB-BAND FULL DUPLEX CONFIGURATION IN CARRIER AGGREGATION"

GENEVA, March 4 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/042463) for "SUB-BAND FULL DUPLEX CONFIGURATION IN CARRIER AGGREGATION" on Aug 18, 2025. With publication no. WO/2026/043818, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): RYU, Jae Ho (5775 Morehouse DriveSan Diego, California 92121-1714), ABDELGHAFFAR, Muhammad Sayed Khairy (5775 Morehouse DriveSan Diego, California 92121-1714), LEE, Heechoon (5775 M...