INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "STRUCTURE OF SPATIALLY COUPLED MULTIPLE-INPUT MULTIPLE-OUTPUT COMMUNICATIONS"

GENEVA, Feb. 4 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/036077) for "STRUCTURE OF SPATIALLY COUPLED MULTIPLE-INPUT MULTIPLE-OUTPUT COMMUNICATIONS" on Jul 01, 2025. With publication no. WO/2026/024431, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): IVANOV, Kirill (5775 Morehouse DriveSan Diego, California 92121-1714), YANG, Wei (5775 Morehouse DriveSan Diego, California 92121-1714), SUN, Jing (5775 Morehouse ...