INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "SPATIALLY COUPLED MULTIPLE-INPUT MULTIPLE-OUTPUT WITH SHAPING"

GENEVA, March 3 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/040740) for "SPATIALLY COUPLED MULTIPLE-INPUT MULTIPLE-OUTPUT WITH SHAPING" on Aug 05, 2025. With publication no. WO/2026/043636, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): IVANOV, Kirill (5775 Morehouse DriveSan Diego, California 92121-1714), YANG, Wei (5775 Morehouse DriveSan Diego, California 92121-1714), SEN, Pinar (5775 Morehouse DriveSan Dieg...