INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "PACKAGE COMPRISING SUBSTRATE WITH VIA INTERCONNECTS COMPRISING NON-CIRCULAR PLANAR CROSS SECTION"

GENEVA, Feb. 4 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/037386) for "PACKAGE COMPRISING SUBSTRATE WITH VIA INTERCONNECTS COMPRISING NON-CIRCULAR PLANAR CROSS SECTION" on Jul 11, 2025. With publication no. WO/2026/024485, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PATIL, Aniket (5775 Morehouse DriveSan Diego, California 92121-1714), BUOT, Joan Rey Villarba (5775 Morehouse DriveSan Diego, California 92121-...