INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTEGRATED DEVICE PACKAGE LIDS WITH COMPLIANT FEATURES"

GENEVA, March 31 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/043511) for "INTEGRATED DEVICE PACKAGE LIDS WITH COMPLIANT FEATURES" on Aug 26, 2025. With publication no. WO/2026/064083, the details related to the patent application was published on Mar 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DE LOS HEROS BEUNZA, Luis Eduardo (5775 Morehouse DriveSan Diego, California 92121), CASTILLO CHACON, Julian Eduardo (5775 Morehouse DriveSan Diego, California 92121), ROGGEMAN, Brian...