INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "INTEGRATED CIRCUIT (IC) PACKAGE HAVING A PACKAGE INTERCONNECT INCLUDING A PILLAR AND A SOLDER CAP COUPLED TO A BOTTOM SURFACE OF THE PILLAR TO REDUCE THE HEIGHT OF THE IC PACKAGE"

GENEVA, May 12 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/051839) for "INTEGRATED CIRCUIT (IC) PACKAGE HAVING A PACKAGE INTERCONNECT INCLUDING A PILLAR AND A SOLDER CAP COUPLED TO A BOTTOM SURFACE OF THE PILLAR TO REDUCE THE HEIGHT OF THE IC PACKAGE" on Oct 21, 2025. With publication no. WO/2026/096241, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KANG, Kyudong (5775 Morehouse DriveSan Diego, California 9212...