INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "HYBRID SILICON CAP LSC TO INCREASE BGA DENSITY"

GENEVA, April 8 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/046430) for "HYBRID SILICON CAP LSC TO INCREASE BGA DENSITY" on Sep 15, 2025. With publication no. WO/2026/072367, the details related to the patent application was published on Apr 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PATIL, Aniket (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), ALDRETE, Manuel (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), GUPTA, P...