INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "HIGH-CAPACITY AND HIGH-BANDWIDTH THREE-DIMENSIONAL DYNAMIC RANDOM-ACCESS MEMORY (3D DRAM) INTEGRATION IN STANDARD DRAM SYSTEM-IN-PACKAGE (SIP)"

GENEVA, March 11 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/044126) for "HIGH-CAPACITY AND HIGH-BANDWIDTH THREE-DIMENSIONAL DYNAMIC RANDOM-ACCESS MEMORY (3D DRAM) INTEGRATION IN STANDARD DRAM SYSTEM-IN-PACKAGE (SIP)" on Aug 29, 2025. With publication no. WO/2026/050602, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BADAROGLU, Mustafa (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714),...