INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "HIGH-BANDWIDTH 3D STACKED MEMORY WITH A BASE DIE ENABLING COMPUTE LOGIC WITHOUT MEMORY POWER GRID RESTRICTIONS"

GENEVA, Dec. 23 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/023719) for "HIGH-BANDWIDTH 3D STACKED MEMORY WITH A BASE DIE ENABLING COMPUTE LOGIC WITHOUT MEMORY POWER GRID RESTRICTIONS" on Apr 08, 2025. With publication no. WO/2025/259352, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BADAROGLU, Mustafa (5775 Morehouse DriveSan Diego, California 92121-1714), WANG, Zhongze (5775 Morehouse DriveSan Diego, Califor...