INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "ENHANCING ADAPTIVE ROUNDING (ADAROUND) AND LOW-RANK ADAPTATION ROUNDING (LORA-ROUNDING) FOR LARGER DEGREES OF FREEDOM"

GENEVA, March 24 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/037184) for "ENHANCING ADAPTIVE ROUNDING (ADAROUND) AND LOW-RANK ADAPTATION ROUNDING (LORA-ROUNDING) FOR LARGER DEGREES OF FREEDOM" on Jul 10, 2025. With publication no. WO/2026/059647, the details related to the patent application was published on Mar 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YOU, Jaeseong (5775 Morehouse DriveSan Diego, California 92121), PARK, Minseop (5775 Morehouse DriveSan Diego, Californi...