INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "ENHANCED INTEGRATED CIRCUIT HEAT DISSIPATION USING INACTIVE METAL LINES"

GENEVA, Sept. 10 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/013231) for "ENHANCED INTEGRATED CIRCUIT HEAT DISSIPATION USING INACTIVE METAL LINES" on Jan 27, 2025. With publication no. WO/2025/183834, the details related to the patent application was published on Sep 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEPAKSHA, Hithesh Hassan (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), NANDANWAR, Darshan Kumar (International IP Administration5775 Mo...