INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "DYNAMICALLY RECONFIGURED REDUNDANT LANES IN A COMMUNICATION INTERFACE CIRCUIT BETWEEN CHIPLETS TO INCREASE REDUNDANCY WHEN THE PROBABILITY OF FAILURE FAVORS A PARTICULAR COMMUNICATION DIRECTION"

GENEVA, Feb. 4 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/032019) for "DYNAMICALLY RECONFIGURED REDUNDANT LANES IN A COMMUNICATION INTERFACE CIRCUIT BETWEEN CHIPLETS TO INCREASE REDUNDANCY WHEN THE PROBABILITY OF FAILURE FAVORS A PARTICULAR COMMUNICATION DIRECTION" on Jun 03, 2025. With publication no. WO/2026/024362, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DODDI, Ravindranath (5775 Morehouse DriveSan D...