INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "DEVICE INCLUDING SUBSTRATE WITH EMBEDDED COMPONENT"

GENEVA, March 24 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/043502) for "DEVICE INCLUDING SUBSTRATE WITH EMBEDDED COMPONENT" on Aug 26, 2025. With publication no. WO/2026/059727, the details related to the patent application was published on Mar 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SHIN, Heun Gun (5775 Morehouse DriveSan Diego, California 92121), KANG, Kyudong (5775 Morehouse DriveSan Diego, California 92121), LIN, Tsu-Wei (5775 Morehouse DriveSan Diego, California ...