INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "DEEP TRENCH CAPACITOR (DTC) PAD ON SOLDER RESIST (SR) LAYER"

GENEVA, Dec. 2 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/027573) for "DEEP TRENCH CAPACITOR (DTC) PAD ON SOLDER RESIST (SR) LAYER" on May 02, 2025. With publication no. WO/2025/244819, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BUOT, Joan Rey Villarba (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), WANG, Zhijie (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92...