INTERNATIONAL PATENT: QUALCOMM INCORPORATED FILES APPLICATION FOR "ADHERED SAP SUBSTRATE FOR CUBOL ASSEMBLY PACKAGE"

GENEVA, March 31 -- QUALCOMM INCORPORATED (ATTN: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714) filed a patent application (PCT/US2025/042141) for "ADHERED SAP SUBSTRATE FOR CUBOL ASSEMBLY PACKAGE" on Aug 15, 2025. With publication no. WO/2026/064047, the details related to the patent application was published on Mar 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MOON, Hyun-Il (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), KANG, Kuiwon (QUALCOMM Incorporated5775 Morehouse DriveSan Diego, California 92121-1714), BUOT, Jo...