GENEVA, Feb. 15 -- QUALCOMM INCORPORATED (ATTN: International IP Administration, 5775 Morehouse Drive San DiegoCalifornia 92121-1714), YIN, Mingxi (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), XU, Changlong (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), WEI, Chao (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), JIA, Yinhua (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), TAKEDA, Kazuki (5775 Morehouse Drive, San DiegoCalifornia 92121-1714) filed a patent application (PCT/CN2024/110286) for "FIXED-SIZE INTERLEAVER DESIGN IN AMBIENT IOT" on Aug 07, 2024. With publication no. WO/2026/030957, the details related to the patent application was published on Feb 12, 2026.
Notably, the patent application was submitt...