GENEVA, Feb. 20 -- QUALCOMM INCORPORATED (Attn: International IP Administration5775 Morehouse DriveSan Diego, California 92121-1714), IBRAHIM, Abdelrahman Mohamed Ahmed Mohamed (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), HAO, Chenxi (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), YOO, Taesang (5775 Morehouse Drive, San DiegoCalifornia 92121-1714), BALEVI, Eren (5775 Morehouse Drive, San DiegoCalifornia 92121-1714) filed a patent application (PCT/CN2024/112668) for "INTER-VENDOR COLLABORATION WITH TEMPORAL COMPRESSION" on Aug 16, 2024. With publication no. WO/2026/036374, the details related to the patent application was published on Feb 19, 2026.

Notably, the patent application was submitted under the International Pate...