INTERNATIONAL PATENT: QORVO US, INC. FILES APPLICATION FOR "WAFER-LEVEL CHIP-SCALE PACKAGING CAPACITIVE MEMS SENSOR"

GENEVA, March 11 -- QORVO US, INC. (7628 Thorndike RoadGreensboro, North Carolina 27409) filed a patent application (PCT/US2025/041056) for "WAFER-LEVEL CHIP-SCALE PACKAGING CAPACITIVE MEMS SENSOR" on Aug 07, 2025. With publication no. WO/2026/049964, the details related to the patent application was published on Mar 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHEN, Yenhao (2940 North 1st St.San Jose, California 95134), KWA, Tom A. (2940 North 1st St.San Jose, California 95134), TSAI, Julius Minglin (2940 North 1st St.San Jose, California 95134)

Abstract: The present disclosure rela...