GENEVA, Oct. 9 -- TOYO SEIKAN CO., LTD. filed a patent application (JP2026/009603) for “PRECURSOR FOR MOLDING SEAMLESS ALUMINUM CAN”. With publication no. WO/2026/211232, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B65D 1/16
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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