International Patent: PRECISE CONTROL OF ETCH TOPOGRAPHY AND PATTERN TRANSFER

GENEVA, Aug. 7 -- APPLIED MATERIALS, INC. filed a patent application (US2025/013337) for “PRECISE CONTROL OF ETCH TOPOGRAPHY AND PATTERN TRANSFER”. With publication no. WO/2026/164597, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H01L 21/311

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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