International Patent: POWER SEMICONDUCTOR MODULE AND ASSEMBLY METHOD

GENEVA, Oct. 5 -- HITACHI ENERGY LTD filed a patent application (EP2026/057721) for “POWER SEMICONDUCTOR MODULE AND ASSEMBLY METHOD”. With publication no. WO/2026/201746, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 90/10

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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