GENEVA, June 19 -- MICROCHIP TECHNOLOGY INCORPORATED filed a patent application (US2025/017050) for “POWER MODULE WITH LOCAL HEAT SPREADER”. With publication no. WO/2026/106625, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 25/07
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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