International Patent: POLYMER COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION, INSULATING FILM, AND ELECTRONIC DEVICE COMPRISING SAME

GENEVA, July 9 -- DONGJIN SEMICHEM CO., LTD. filed a patent application (KR2025/021196) for “POLYMER COMPOUND, PHOTOSENSITIVE RESIN COMPOSITION, INSULATING FILM, AND ELECTRONIC DEVICE COMPRISING SAME”. With publication no. WO/2026/146960, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08G 73/10

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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