International Patent: POLISHING AGENT, POLISHING AGENT ADDITIVE LIQUID, POLISHING METHOD, AND SEMICONDUCTOR COMPONENT PRODUCTION METHOD

GENEVA, Oct. 9 -- AGC INC. filed a patent application (JP2026/011921) for “POLISHING AGENT, POLISHING AGENT ADDITIVE LIQUID, POLISHING METHOD, AND SEMICONDUCTOR COMPONENT PRODUCTION METHOD”. With publication no. WO/2026/211470, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C09K 3/14

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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