International Patent: PLATED METAL ON PAD AND TRACE FOR METAL CONSUMPTION AND PDN PERFORMANCE IMPROVEMENT

GENEVA, July 1 -- QUALCOMM INCORPORATED filed a patent application (US2025/058347) for “PLATED METAL ON PAD AND TRACE FOR METAL CONSUMPTION AND PDN PERFORMANCE IMPROVEMENT”. With publication no. WO/2026/128317, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 70/05

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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