GENEVA, Jan. 27 -- PLATBIZ CO., LTD. (407, 232, Gaepo-roGangnam-guSeoul 06308), 주식회사 플랫비즈 (서울특별시강남구개포로 232, 407호) filed a patent application (PCT/KR2025/009380) for "AIR PACKAGE FOR LOGISTICS PACKAGING" on Jul 01, 2025. With publication no. WO/2026/019114, the details related to the patent application was published on Jan 22, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): JUNG, Byungho (1408-902, 19, Dongtandaerosibeom-gilHwaseong-siGyeonggi-do 18477), ...