International Patent: PIXEL UNIT AND MANUFACTURING METHOD, PIXEL ARRAY, IMAGE SENSOR, AND CHIP

GENEVA, Oct. 30 -- BYD COMPANY LIMITED filed a patent application (CN2026/082786) for “PIXEL UNIT AND MANUFACTURING METHOD, PIXEL ARRAY, IMAGE SENSOR, AND CHIP”. With publication no. WO/2026/223258, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10F 39/18

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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