GENEVA, Oct. 30 -- KOKUSAI ELECTRIC CORPORATION filed a patent application (JP2025/015482) for “PIPING STRUCTURE, SUBSTRATE PROCESSING DEVICE, EXHAUST METHOD, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE”. With publication no. WO/2026/224782, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: F16L 23/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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