International Patent: PHYSICS MODEL-BASED HYBRID ARTIFICIAL INTELLIGENCE SYSTEM AND CONTROL METHOD FOR PCB THICKNESS PREDICTION

GENEVA, Oct. 30 -- INTER X CO., LTD. filed a patent application (KR2026/096186) for “PHYSICS MODEL-BASED HYBRID ARTIFICIAL INTELLIGENCE SYSTEM AND CONTROL METHOD FOR PCB THICKNESS PREDICTION”. With publication no. WO/2026/225987, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G01B 21/08

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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