GENEVA, July 6 -- HELIATEK GMBH filed a patent application (DE2025/101202) for “PHOTOVOLTAIC MODULE HAVING AN ELECTRICALLY CONDUCTIVE REAR-SIDE BARRIER AS A BYPASS BETWEEN TWO JUNCTION BOXES”. With publication no. WO/2026/139112, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H02S 40/34
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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