GENEVA, July 9 -- RESONAC CORPORATION filed a patent application (JP2025/036470) for “PHOTOSENSITIVE RESIN COMPOSITION, CURED RESIN FILM, AND IMAGE DISPLAY ELEMENT”. With publication no. WO/2026/146583, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: G03F 7/004
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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