International Patent: PERFORATED GLASS SUBSTRATE FOR SEMICONDUCTOR PACKAGE, GLASS SUBSTRATE FOR SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PERFORATED GLASS SUBSTRATE FOR SEMICONDUCTOR PACKAGE

GENEVA, July 6 -- NIPPON ELECTRIC GLASS CO., LTD. filed a patent application (JP2025/044887) for “PERFORATED GLASS SUBSTRATE FOR SEMICONDUCTOR PACKAGE, GLASS SUBSTRATE FOR SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING PERFORATED GLASS SUBSTRATE FOR SEMICONDUCTOR PACKAGE”. With publication no. WO/2026/141312, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C03C 3/091

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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