INTERNATIONAL PATENT: PEKING UNIVERSITY, 北京大学 FILES APPLICATION FOR "INTERFACE LEAD-OUT METHOD FOR FLIP-CHIP STACKED TRANSISTOR, TRANSISTOR, COMPONENT AND DEVICE"

GENEVA, Feb. 1 -- PEKING UNIVERSITY (No.5 Yiheyuan RoadHaidian District, Beijing 100871), 北京大学 (中国北京市海淀区颐和园路5号) filed a patent application (PCT/CN2025/077596) for "INTERFACE LEAD-OUT METHOD FOR FLIP-CHIP STACKED TRANSISTOR, TRANSISTOR, COMPONENT, AND DEVICE" on Feb 17, 2025. With publication no. WO/2026/020797, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WU, Heng (No.5 Yiheyuan RoadHaidian District, B...