GENEVA, Feb. 17 -- PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. (22-6, Moto-machi, Kadoma-shi, Osaka5710057), パナソニックＩＰマネジメント株式会社 (大阪府門真市元町２２番６号) filed a patent application (PCT/JP2025/027346) for "LIQUID RESIN COMPOSITION, SEMICONDUCTOR SEALING MATERIAL, UNDERFILL MATERIAL, AND SEMICONDUCTOR DEVICE" on Aug 01, 2025. With publication no. WO/2026/034380, the details related to the patent application was published on Feb 12, 2026.
Notably, the patent application was submitted under the International Patent Classification ...