GENEVA, July 1 -- SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD filed a patent application (CN2025/092945) for “PACKAGING METHOD FOR PACKAGING STRUCTURE AND PACKAGING STRUCTURE”. With publication no. WO/2026/123568, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01L 21/50
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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