GENEVA, Aug. 14 -- DAI NIPPON PRINTING CO., LTD. filed a patent application (JP2026/004695) for “PACKAGING MATERIAL FOR POWER STORAGE DEVICE, METHOD FOR MANUFACTURING PACKAGING MATERIAL, POWER STORAGE DEVICE, MOBILE BODY, AND ELECTRONIC APPARATUS”. With publication no. WO/2026/168611, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: H01M 50/131
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....