International Patent: PACKAGE FOR SIDE-BY-SIDE DIES AND PARTIALLY OVERLAPPING INTERCONNECTED SUBSTRATES

GENEVA, Sept. 24 -- QUALCOMM INCORPORATED filed a patent application (US2026/018612) for “PACKAGE FOR SIDE-BY-SIDE DIES AND PARTIALLY OVERLAPPING INTERCONNECTED SUBSTRATES”. With publication no. WO/2026/198290, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 90/10

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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