International Patent: PACKAGE COMPRISING AN INTEGRATED DEVICE, AN ENCAPSULATION LAYER AND VIA INTERCONNECTS CONFIGURED FOR ELECTROMAGNETIC SHIELDING

GENEVA, July 2 -- QUALCOMM INCORPORATED filed a patent application (US2025/056444) for “PACKAGE COMPRISING AN INTEGRATED DEVICE, AN ENCAPSULATION LAYER AND VIA INTERCONNECTS CONFIGURED FOR ELECTROMAGNETIC SHIELDING”. With publication no. WO/2026/135926, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 42/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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