International Patent: PACKAGE COMPRISING A SUBSTRATE WITH IMPROVED VIA INTERCONNECT CONFIGURATION FOR IMPROVED THERMAL PERFORMANCE

GENEVA, Sept. 24 -- QUALCOMM INCORPORATED filed a patent application (US2026/018098) for “PACKAGE COMPRISING A SUBSTRATE WITH IMPROVED VIA INTERCONNECT CONFIGURATION FOR IMPROVED THERMAL PERFORMANCE”. With publication no. WO/2026/198265, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 72/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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