INTERNATIONAL PATENT: OWENS CORNING INTELLECTUAL CAPITAL, LLC FILES APPLICATION FOR "HIGH MODULUS FIBERGLASS COMPOSITION"

GENEVA, March 31 -- OWENS CORNING INTELLECTUAL CAPITAL, LLC (One Owens Corning ParkwayToledo, Ohio 43659) filed a patent application (PCT/US2025/046369) for "HIGH MODULUS FIBERGLASS COMPOSITION" on Sep 15, 2025. With publication no. WO/2026/064238, the details related to the patent application was published on Mar 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KORWIN-EDSON, Michelle L. (109 Blue Stone Ct.Granville, Ohio 43023)

Abstract: A high modulus glass composition is disclosed that is substantially free of lithium and rare earth oxides (Re2O3), while also achieving a Young's modul...