INTERNATIONAL PATENT: NTN CORPORATION, ＮＴＮ株式会社 FILES APPLICATION FOR "SPINDLE DEVICE, GRINDING DEVICE AND CUTTING MACHINING DEVICE"

GENEVA, March 24 -- NTN CORPORATION (3-6-32, Nakanoshima, Kita-ku, Osaka-shi, Osaka5300005), ＮＴＮ株式会社 (大阪府大阪市北区中之島三丁目６番３２号) filed a patent application (PCT/JP2025/029309) for "SPINDLE DEVICE, GRINDING DEVICE, AND CUTTING MACHINING DEVICE" on Aug 21, 2025. With publication no. WO/2026/058666, the details related to the patent application was published on Mar 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TANAK...