GENEVA, Feb. 17 -- NITTO DENKO CORPORATION (1-2, Shimohozumi 1-chome, Ibaraki-shi, Osaka5678680), 日東電工株式会社 (大阪府茨木市下穂積１丁目１番２号) filed a patent application (PCT/JP2025/025209) for "WOUND FILM EQUIPPED WITH ADHESIVE LAYER" on Jul 14, 2025. With publication no. WO/2026/034132, the details related to the patent application was published on Feb 12, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): UTSUNOMIYA Tatsuya (c/o NITTO DENKO CO...