GENEVA, Nov. 3 -- NITTO DENKO CORPORATION (1-1-2, Shimohozumi, Ibaraki-shi, Osaka5678680), 日東電工株式会社 (大阪府茨木市下穂積１丁目１番２号) filed a patent application (PCT/JP2025/005315) for "METHOD FOR MANUFACTURING HOLOGRAM SUBSTRATE, HOLOGRAM SUBSTRATE, METHOD FOR MANUFACTURING REPLICA HOLOGRAM SUBSTRATE, AND METHOD FOR MANUFACTURING LAMINATED HOLOGRAM ELEMENT" on Feb 18, 2025. With publication no. WO/2025/225142, the details related to the patent application was published on Oct 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system...